VEECO INSTRUMENTS INC
For the period ended Jun 30, 2026. Filed Aug 5, 2026.
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A company's report for each of its first three quarters. The financial statements are not audited. It shows how the business has moved since the last annual report, and what management says changed.
Jun 30, 2026 · Filed Aug 5, 2026
VECO$37.19+11.8%Stored close · as of Nov 6, 2026
What changed in Management’s Discussion and Analysis?
Read the current filingPrevious report: 10-Q
Period ended 2026-03-31; filed 2026-05-05.
0001104659-26-055672
Item 2. Management’s Discussion and Analysis of Financial Condition and Results of OperationsCurrent report: 10-Q
Period ended 2026-06-30; filed 2026-08-05.
0001104659-26-091158
Item 2. Management’s Discussion and Analysis of Financial Condition and Results of OperationsThe baseline is this issuer’s latest earlier reporting period of the same form that was filed before the current report. A previous 10-Q is a different quarter, not a year-over-year comparison. Amendments are excluded.
Compared 71 previous paragraphs and 90 current paragraphs.
38 unchanged; 28 reworded; 16 added; 3 removed; 2 previous and 8 current paragraphs rearranged.
Tables are not compared: 6 previous and 8 current tables excluded. Dates, whitespace, punctuation and numbering changes are ignored; changes to financial figures remain significant.
A changed paragraph is not evidence that risk increased or decreased. An unchanged paragraph does not establish that risk stayed the same.
Added paragraphs (16)
Current report
In the memory market, we continue to expand our presence as there is significant long-term opportunity as AI-driven computing architecture accelerates demand for Dynamic Random Access Memory (“DRAM”) and NAND technologies. These technology transitions are creating new thermal processing and material requirements that align well with our differentiated annealing capabilities. The memory industry is at the early stages of adopting laser-based technologies for annealing applications. We continue to make solid progress with leading memory customers, including serving as the production tool of record at a Tier 1 HBM customer, that is accelerating their investments in 2026. We are also advancing an LSA evaluation system at a second Tier 1 DRAM customer, with potential for follow-on orders in 2027 and 2028. Customer engagement continues to expand with a third DRAM customer, with potential to enter an evaluation agreement over the coming quarters. Furthermore, we are encouraged by several NAND customers who are exploring applications for our LSA and NSA platforms, which are continuing to advance well.
Current report
In Advanced Packaging (“AP”), which includes our wet processing and lithography systems, we continue to experience increased demand as AI-related investments accelerate adoption of heterogenous integration of advanced 2.5D and 3D architectures. In the second quarter, we had an increase in orders for our wet processing and lithography systems from leading OSAT customers. We are also working with a Tier 1 foundry on a panel wet processing tool opportunity, and we are encouraged by our engagement. AP continues to provide meaningful momentum to Veeco, as we progress through
Current report
the year, bringing increased visibility through 2027. The sustained interest from leading customers in our ability to enable their extreme ramp and AP roadmap supports our confidence in the outlook for the business.
Current report
We continue to benefit from the growing demand tied to AI, particularly through our exposure to Silicon Photonics and the Indium Phosphide (“InP”) lasers used for optical connectivity applications. Industry investment remains focused on hyperscalers' need for higher bandwidth and optical connectivity across increasingly large AI data clusters. As bandwidth requirements continue to accelerate, the industry is increasingly focused on overcoming the "copper wall," where traditional electrical interconnects become less efficient at supporting higher-speed data transmission. At the same time, hyperscalers continue to advance optical networking architectures, including evolution of EML pluggables, Silicon Photonics pluggables, as well as the longer-term solutions of near-package and co-packaged optics. Collectively, these trends are driving broader adoption of optical connectivity throughout the AI infrastructure ecosystem. These architectures increasingly rely on InP laser technologies, which are critical to next-generation AI networking and optical interconnect solutions.
Current report
Overall, our SAM expansion is driven by two key market inflections. First, the exponential growth of optical connectivity bandwidth requirement due to agentic AI, leading to a corresponding growth in high-power InP Continuous Wave laser demand and thus InP epitaxy. Second, the exponential growth in power demand is simultaneously driving the number of laser diodes, but more importantly power required per laser diode, leading to higher reliability requirements from laser facet coating solutions.
Current report
First, the MOCVD epitaxy steps play a crucial role and we are continuing to penetrate the market with our Lumina MOCVD InP Platform as leading photonics customers expand capacity. In the second quarter, a global leader in optical and photonic technologies selected our Lumina+ MOCVD system to fabricate InP lasers for innovative communication solutions in the datacom industry. Second, we are a market leader with our WaferEtch and WaferStorm wet processing technologies for advanced etching and surface preparation. Third, we remain a market leader with our Spector IBD tool for the critical laser facet coating step. From ongoing customer engagements, we believe our IBD technology remains differentiated from traditional approaches, as the industry transitions to higher powered lasers which demand stricter film specifications.
Current report
For the six months ended June 30, 2026 and 2025
Current report
Net Sales
Current report
Gross Profit
Current report
Research and Development
Current report
Selling, General, and Administrative
Current report
Selling, general, and administrative expenses increased for the six months ended June 30, 2026 against the comparable prior period due variable incentive related compensation and commission expenses based on increased order volume.
Current report
Merger Costs
Current report
Interest Income (Expense)
Current report
Income Taxes
Current report
equity programs, settlement of the 2027 Notes, and debt issuance costs associated with the execution of the Fourth Amendment of the Loan and Security Agreement, partially offset by cash received under the Employee Stock Purchase Plan.
Removed paragraphs (3)
Previous report
In the memory market, we continue to expand our presence as current and future roadmap requirements for Dynamic-Random-Access Memory (“DRAM”) drive the need for low-thermal-budget anneals used in high-band-width memory and vertical DRAM devices. We are the production tool of record at a leading high-bandwidth memory customer, and we continue to make progress with another LSA evaluation system at a second Tier 1 DRAM customer, with potential for pilot line orders in the second half of 2026.
Previous report
In Advanced Packaging (“AP”), our wet processing systems are used for several applications, and we continue to see strong demand driven by Heterogenous Integration and 2.5D and 3D Packaging for AI and high-performance computing. In the first quarter, we had an increase in orders for our wet processing systems from leading OSAT customers, supporting high-volume manufacturing of next-generation AI accelerators using 2.5D AP architectures.
Previous report
Not meaningful
Reworded paragraphs (28)
Previous wording
On September 30, 2025, we entered into an Agreement and Plan of Merger (the “Merger Agreement”) with Axcelis Technologies, Inc., a Delaware corporation (“Axcelis”), and Victory Merger Sub, Inc., a Delaware corporation and a wholly-owned subsidiary of Axcelis (“Merger Sub”). Pursuant to the Merger Agreement, and subject to the satisfaction or waiver of the conditions specified therein, Merger Sub shall be merged with and into Veeco (the “Merger”), with Veeco surviving as a wholly-owned subsidiary of Axcelis. The Merger Agreement was approved by our board of directors (except for one (1) independent director who serves on the Axcelis’ board of directors as well who recused himself) and, on February 6, 2026, by the stockholders of each company. The completion of the Merger remains subject to the satisfaction or (to the extent permissible) waiver of customary closing conditions, including the final pending regulatory approval from the State Administration for Market Regulation of the People’s Republic of China.
Current wording
On September 30, 2025, we entered into an Agreement and Plan of Merger (the “Merger Agreement”) with Axcelis Technologies, Inc., a Delaware corporation (“Axcelis”), and Victory Merger Sub, Inc., a Delaware corporation and a wholly-owned subsidiary of Axcelis (“Merger Sub”). Pursuant to the Merger Agreement, and subject to the satisfaction or waiver of the conditions specified therein, Merger Sub shall be merged with and into Veeco (the “Merger”), with Veeco surviving as a wholly-owned subsidiary of Axcelis. The Merger Agreement was approved by our board of directors (except for one (1) independent director who serves on the Axcelis’ board of directors as well who recused himself) and, on February 6, 2026, by the stockholders of each company. The completion of the Merger remains subject to the satisfaction or (to the extent permissible) waiver of customary closing conditions, including the final pending regulatory approval from the State Administration for Market Regulation of the People’s Republic of China, and is currently expected to close in the second half of 2026.
Previous wording
Sales in the Semiconductor industry are estimated to have increased year-over-year in 2025 to approximately $770 billion dollars, according to Gartner. Looking ahead, industry analysts are forecasting long-term growth of the industry, driven by secular growth trends such as artificial intelligence, high-performance computing, mobile connectivity, and the electrification of the automotive industry. Additionally, government investments in the Semiconductor industry are projected to accelerate global spending in next-generation technologies.
Current wording
The Semiconductor industry experienced robust growth in 2025 and, looking ahead, industry analysts are forecasting long-term growth of the industry, driven by secular growth trends such as artificial intelligence (“AI”), high-performance computing, advanced connectivity, and the electrification of the automotive industry. Additionally, government investments in the Semiconductor industry are projected to accelerate global spending in next-generation technologies.
Previous wording
Growth in the Semiconductor industry, coupled with increasing technological complexity of Semiconductor chips, are expected to drive long-term growth in Wafer Fab Equipment (“WFE”) spending. In an effort to improve chip performance, optimize power consumption, and reduce costs, today’s most advanced Semiconductor manufacturers are shrinking device geometries, investing in more complex transistor designs such as Gate-All-Around and exploring 3D
Current wording
Growth in the Semiconductor industry driven by AI investments, coupled with increasing technological complexity of Semiconductor chips, are expected to drive long-term growth in Wafer Fab Equipment (“WFE”) spending. In an effort to improve chip performance, optimize power consumption, and reduce costs, today’s most advanced Semiconductor manufacturers are shrinking device geometries, investing in more complex transistor designs such as Gate-All-Around and exploring 3D architectures. As a result, growth of the WFE market is forecasted to keep pace with long-term growth
Previous wording
architectures. As a result, growth of the WFE market is forecasted to keep pace with long-term growth of the Semiconductor industry, which we believe should benefit semiconductor capital equipment providers, including Veeco.
Current wording
of the Semiconductor industry, which we believe should benefit semiconductor capital equipment providers, including Veeco.
Previous wording
Veeco’s technologies are at the forefront of enabling new technical innovations in the manufacturing of high-performance AI chips and High-Bandwidth Memory (“HBM”). We continue to invest in new technologies to expand our Serviceable Available Market (“SAM”) to a broad range of new applications.
Current wording
Veeco’s technologies are at the forefront of enabling new technical innovations in the manufacturing of high-performance AI chips, advanced connectivity and High-Bandwidth Memory (“HBM”). We continue to invest in new technologies to expand our Serviceable Available Market (“SAM”) to a broad range of new applications.
Previous wording
Semiconductor revenue comprised 69% of first quarter total revenue primarily driven by system shipments of our Laser Spike Annealing (“LSA”), and our Advanced Packaging, wet processing and lithography products. Semiconductor revenue decreased 12% from the comparable prior period due to a reduction in China revenue of 74% partially offset by increases in Rest of APAC revenue of 38% and United States revenue of 69%.
Current wording
Semiconductor revenue comprised 68% of second quarter total revenue primarily driven by system shipments of our Laser Spike Annealing (“LSA”) technology, and our Advanced Packaging technology, particularly for our wet processing products. Semiconductor revenue increased 5% from the comparable prior period due to increase in sales to our leading-edge foundry/logic and memory customers.
Previous wording
In the logic market, our annealing solutions continue to gain traction at advanced node customers. Our LSA platform is production tool of record at all three Tier 1 logic customers. Our next-generation Nanosecond Annealing (“NSA”) system is progressing through evaluations at Tier 1 logic customers. Our NSA tool addresses critical low-thermal budget applications such as contact annealing, 3D device integration and materials modification. These evaluations are advancing well, and we are anticipating an additional evaluation shipment to a third Tier 1 logic customer in the coming months.
Current wording
In logic and foundry, we have long-standing and trusted customer relations and our annealing solutions continue to gain traction at advanced node customers. Our LSA platform is production tool of record at all three Tier 1 logic customers, driving repeat business. Additionally, our next-generation Nanosecond Annealing (“NSA”) system tool addresses critical low-thermal budget applications such as contact annealing, 3D device integration and materials modification. In the second quarter, for our NSA system we announced that a Tier 1 customer successfully completed their evaluation and placed a follow-on order for a second system to ship in the second half of 2026. We also announced in the second quarter, that the third Tier 1 logic customer received an NSA evaluation tool. We have now successfully engaged all three Tier 1 logic and foundry customers with our NSA technology, and we continue working closely with them to support high-volume manufacturing.
Previous wording
We also have two Ion Beam Deposition “IBD300” systems under evaluation at leading DRAM memory customers. Our IBD300 system provides Veeco with another opportunity to expand our SAM to advanced node applications where low resistance films are critical. These initial systems are being evaluated for advanced memory applications, such as DRAM bitline metallization.
Current wording
We also have two Ion Beam Deposition 300 (“IBD300”) systems under evaluation at leading DRAM memory customers. Our IBD300 system provides Veeco with another opportunity to expand our SAM to advanced node applications where low resistance films are critical. These initial systems are being evaluated for advanced memory applications, such as DRAM bitline metallization.
Previous wording
The ongoing adoption of EUV Lithography for advanced node semiconductor manufacturing continues to drive demand for our Ion Beam Deposition EUV system for mask blanks. Leading logic and memory customers expect EUV and High Numerical Aperture (“High-NA”) lithography to be integral to their future roadmaps. Our Ion Beam Deposition technology is a key enabler of the EUV mask blank Multiple Layer Mirror deposition. Our product roadmap is well positioned as the industry adopts next-generation High-NA EUV lithography, and we are expanding our EUV related business to EUV pellicles which are increasingly being used to improve the productivity of EUV steps. Our IBD-EUV system is also used to form the high-transparency membrane used in pellicles.
Current wording
The ongoing adoption of EUV Lithography for advanced node semiconductor manufacturing continues to drive demand for our Ion Beam Deposition (“IBD”) EUV system for mask blanks. Leading logic and memory manufacturers expect EUV and High Numerical Aperture (“High-NA”) lithography to be integral to their future roadmaps. Our IBD technology is a key enabler of the EUV mask blank Multiple Layer Mirror deposition. Our product roadmap is well positioned as the industry adopts next-generation High-NA EUV lithography, and we are expanding our EUV related business to EUV pellicles, which are increasingly being used to protect defect-free masks and improve productivity as EUV utilization scales. We continue to win production business at a Tier 1 foundry and engage new customers for EUV pellicles.
Previous wording
Looking ahead, we anticipate growth in the semiconductor market in leading-edge investment driven by AI and high-performance computing.
Current wording
Looking ahead, we anticipate growth in the semiconductor market in leading-edge investment driven by AI investments.
Previous wording
Compound Semiconductor revenue increased by 31% in the first quarter from the comparable prior year period, comprising 12% of total revenue. In the Compound Semiconductor market, we have a broad portfolio of products which are gaining momentum due to a significant inflection point within the industry with AI data center infrastructure build-out.
Current wording
Compound Semiconductor revenue increased by 45% in the second quarter from the comparable prior year period, comprising 11% of total revenue. In the Compound Semiconductor market, we have a broad portfolio of products which are gaining momentum due to a significant inflection point within the industry due to the AI data center infrastructure build-out.
Previous wording
The AI build-out is impacting interconnects where there is a shift from copper wiring to pluggables and co-packaged optics as data centers demand higher-speed and lower-power communication. Within this space, Indium Phosphide (“InP”) lasers are a major component as the light-source for pluggables and co-packaged optics for next-generation AI infrastructure. As the industry transitions toward future capacity requirements, we believe this represents growth opportunity of approximately $2.0 billion dollars over the next several years. Our technology plays a critical role within the manufacturing of InP lasers and order demand is greatly accelerating across multiple of our products. These products include Lumina MOCVD Arsenide Phosphide batch platform, Wafer Etch and Wafer Storm for etching and metal lift-off, and importantly our Spector ion beam deposition for the laser diode facet coatings. Our Spector ion beam deposition system, designed for the critical laser facet coating step, is essential to the process. Veeco is the market leader in ion beam deposition and is highly differentiated from traditional approaches such as E-beam evaporation, ion assisted deposition or physical vapor deposition (“PVD”). Compared with other approaches, the Spector Ion Beam Deposition (“IBD”) tool delivers low-loss optical films with tight control of thickness, uniformity, and reflectivity – precision that is required for anti-reflective and high-reflective facet coatings on InP. We received orders over $250 million dollars from multiple customers for our MOCVD, wet processing and ion beam deposition tools to support the manufacturing of InP lasers with deliveries starting in 2026 and significantly accelerating in 2027. A large portion of these orders is from a leading supplier of next-generation 800-gig and 1.6-terabit optical transceivers for hyperscale customers, for our Spector IBD systems. This significant order activity underscores the long-term value of our ion beam deposition technology leadership and our expanding role in this rapidly growing market. We have long-standing partnerships with our customers, spanning more than two decades, and we are well positioned across our multiple differentiated products to meet their growing needs in silicon photonics.
Current wording
Our portfolio spans multiple steps of the laser manufacturing process, including Lumina MOCVD Arsenide Phosphide batch platform for the epitaxy steps, Wafer Etch and Wafer Storm for etching and metal lift-off, and our Spector IBD for the laser diode facet coatings.
Previous wording
Additionally, there are other photonics applications driving growth for our products in this space, including red MircoLEDs, low earth orbit solar cells and augmented / virtual reality applications.
Current wording
Additionally, in the Compound Semiconductor market there are Other Photonics applications driving growth for our products, including red MircoLEDs, low earth orbit solar cells and augmented/virtual reality applications.
Previous wording
Lastly, our Propel300mm GaN on Si product continues to be a strong long-term driver tied to AI data center power efficiency, electrification, and high-power density applications. At a leading power IDM customer, we have an evaluation for our Propel300 system in place, and we received a pilot-line order for a multi-chamber system at the end of 2025. As this leading customer ramps and finalizes long-term capacity plans, there is potential for additional system orders in the second half of 2026 for delivery in 2027.
Current wording
Lastly, our Propel300mm GaN on Si product continues to be a strong long-term driver tied to AI data center power efficiency, electrification, and high-power density applications. At a leading power IDM customer, we have an evaluation for our Propel300 system in place, and we received a pilot-line order for a multi-chamber system at the end of 2025. We believe we are well positioned to participate in future capacity expansions.
Previous wording
Data Storage market revenue increased by 52% in the first quarter from the comparable prior year period, comprising 6% of total revenue. We address the Data Storage market with sales of our Ion Beam technology and wet process systems driven by demand for cloud and AI data centers. We have seen increase in order activity in the back-half of 2025 and increased customer utilization rates as customers gain traction in new technologies like Heat Assisted-Magnetic-Recording (“HAMR”). Orders received in the third and fourth quarter of 2025 for our ion beam and wet processing equipment from demand for cloud and AI data centers, will drive revenue growth in 2026, principally in the second half. Customer engagement remains strong with our business fully booked in 2026 and extending into 2027.
Current wording
Data Storage market revenue increased by 80% in the second quarter from the comparable prior year period, comprising 11% of total revenue. We address the Data Storage market with sales of our Ion Beam technology and wet process systems driven by demand for cloud and AI data centers. We expect full year 2026 to more than double and continue to be booked well into 2027. We are engaged with our customers on their roadmaps, including for Heat Assisted-Magnetic-Recording (“HAMR”) technology, giving us strong momentum in this market.
Previous wording
Scientific & Other market revenue decreased by 9% in the first quarter from the comparable prior year period, comprising 13% of total revenue. Sales in the Scientific & Other market are largely driven by sales to government-funded laboratories, universities, and research institutions. We address the Scientific & Other market with several technologies, including MBE, ALD, MOCVD, Wet Processing, and IBD/IBE, which support diverse R&D and niche low-volume production applications.
Current wording
Scientific & Other market revenue increased by 28% in the second quarter from the comparable prior year period, comprising 10% of total revenue. Sales in the Scientific & Other market are largely driven by sales to government-funded laboratories, universities, and research institutions. We address the Scientific & Other market with several technologies, including MBE, ALD, MOCVD, Wet Processing, and IBD/IBE, which support diverse R&D and niche low-volume production applications.
Previous wording
Compound Semiconductor and Data Storage markets. By geography, sales decreased in the China region, partially offset by increased sales in the Rest of APAC, United States, and EMEA regions. Sales in the Rest of APAC region for the three months ended March 31, 2026 included sales in Taiwan and Japan of $65.6 million and $9.2 million, respectively. Sales in the Rest of APAC region for the three months ended March 31, 2025 included sales in Japan and Taiwan of $32.5 million, and $14.0 million respectively. In light of the global nature of our business, we are impacted by conditions in the various countries in which we and our customers operate, including the recent tariff and trade dynamics. We expect there will continue to be year-to-year variations in our future sales distribution across markets and geographies.
Current wording
Sales increased for the three months ended June 30, 2026 against the comparable prior year period across all markets. By geography, sales increased in the United States, and China regions, partially offset by decreased sales in the Rest of APAC, and EMEA regions. Sales in the Rest of APAC region for the three months ended June 30, 2026 included sales in Taiwan, Singapore, and Japan of $43.4 million, $10.5 million, and $9.8 million, respectively. Sales in the Rest of APAC region for the three months ended June 30, 2025 included sales in Taiwan, Singapore, and Japan of $45.5 million, $23.4 million, and $14.8 million respectively. In light of the global nature of our business, we are impacted by conditions in the various countries in which we and our customers operate, including the recent tariff and trade dynamics. We expect there will continue to be year-to-year variations in our future sales distribution across markets and geographies.
Previous wording
For the three months ended March 31, 2026, gross profit decreased against the comparable prior period primarily due to a decrease in sales volume, as well as a decrease in gross margins. Gross margins decreased principally due to unfavorable product mix and higher logistics costs. Additionally other factors will cause our gross margins to fluctuate each period, including the impact of the evolving tariffs landscape, which may include potential refunds on previously paid tariffs, newly implemented tariffs, or changes to existing tariffs.
Current wording
For the three months ended June 30, 2026, gross profit increased against the comparable prior period primarily due to an increase in sales volume, partially offset by a decrease in gross margins. Gross margins decreased principally due to unfavorable product mix and higher spending, including logistics costs. Additionally other factors will cause our gross margins to fluctuate each period, including the impact of the evolving tariffs landscape, which includes refunds on previously paid tariffs, newly implemented tariffs, or changes to existing tariffs.
Previous wording
Selling, general, and administrative expenses increased for the three months ended March 31, 2026 against the comparable prior period due to personnel-related expenses.
Current wording
Selling, general, and administrative expenses increased for the three months ended June 30, 2026 against the comparable prior period due to variable incentive related compensation and commission expenses based on increased order volume.
Previous wording
During the three months ended March 31, 2026, we incurred an additional $2.0 million in legal, accounting, consulting fees and employee-related costs in connection with the proposed Merger.
Current wording
During the three months ended June 30, 2026, we incurred an additional $1.5 million in legal, accounting, consulting fees and employee-related costs in connection with the proposed Merger.
Previous wording
We recorded net interest income of $1.2 million for the three months ended March 31, 2026, compared to net interest income of $0.8 million for the comparable prior year period. The increase in net interest income was primarily due to reduced interest expense on the 2025 Notes as they matured on January 15, 2025 and the 2027 Notes that were settled on May 15, 2025.
Current wording
We recorded net interest income of $1.2 million for the three months ended June 30, 2026, compared to net interest income of $0.9 million for the comparable prior year period. The increase in net interest income was primarily due to reduced interest expense on the 2025 Notes as they matured on January 15, 2025 and the 2027 Notes that were settled on May 15, 2025.
Previous wording
Our tax benefit for the three months ended March 31, 2026, was $1.2 million, compared to $3.0 million of tax expense for the comparable prior period. For the three months ended March 31, 2026, the effective tax rate was higher than the U.S. statutory tax rate primarily related to a discrete income tax benefit for share-based compensation windfall. For the three months ended March 31, 2025, the effective tax rate was in line with the U.S. statutory tax rate, which included a $1.5 million tax expense related to share-based compensation shortfalls, partially offset by tax benefits related to Foreign-Derived Intangible Income and research and development tax credits.
Current wording
Our tax expense for the three months ended June 30, 2026, was $1.2 million, compared to $0.9 million of tax expense for the comparable prior period. For the three months ended June 30, 2026, the effective tax rate was favorably impacted by the tax benefits related to Foreign-Derived Deduction Eligible Income and research and development tax credits. Additionally, the effective tax rate was also impacted by a discrete income tax benefit resulting from share-based compensation windfall. For the three months ended June 30, 2025, the effective tax rate was lower than the U.S. statutory tax rate primarily relating to tax benefits related to Foreign-Derived Intangible Income and research and development tax credits.
Previous wording
At March 31, 2026 and December 31, 2025, cash and cash equivalents of $34.0 million and $23.6 million, respectively, were held outside the United States. As of March 31, 2026, we had $27.5 million of accumulated undistributed earnings generated by our non-U.S. subsidiaries for which the U.S. tax has previously been provided. Approximately $13.4 million of undistributed earnings will be subject to foreign withholding taxes if distributed back to the United States and we accrued $1.4 million for foreign withholding taxes for the undistributed earnings.
Current wording
At June 30, 2026 and December 31, 2025, cash and cash equivalents of $46.6 million and $23.6 million, respectively, were held outside the United States. As of June 30, 2026, we had $29.2 million of accumulated undistributed earnings generated by our non-U.S. subsidiaries for which the U.S. tax has previously been provided. Approximately $14.2 million of undistributed earnings will be subject to foreign withholding taxes if distributed back to the United States and we have accrued $1.4 million for foreign withholding taxes for the undistributed earnings.
Previous wording
A summary of the cash flow activity for the three months ended March 31, 2026 and 2025 is as follows:
Current wording
A summary of the cash flow activity for the six months ended June 30, 2026 and 2025 is as follows:
Previous wording
Net cash provided by operating activities was $7.9 million for the three months ended March 31, 2026 and was due to net loss of $0.3 million and adjustments for non-cash items of $12.7 million, partially offset by a decrease in cash flow from changes in operating assets and liabilities of $4.4 million. The changes in operating assets and liabilities were largely attributable to an increase in accounts receivables, and inventories, partially offset by an increase in contract liabilities, accrued expenses, and accounts payable.
Current wording
Net cash provided by operating activities was $59.4 million for the six months ended June 30, 2026 and was due to net income of $11.5 million, adjustments for non-cash items of $27.2 million, and an increase in cash flow from changes in operating assets and liabilities of $20.6 million. The changes in operating assets and liabilities were largely attributable to an increase in contract liabilities, accrued expenses, and accounts payable, partially offset by an increase in accounts receivables, and inventories. Net cash provided by operating activities was $29.0 million for the six months ended June 30, 2025 and was due to net income of $23.7 million and adjustments for non-cash items of $30.2 million, partially offset by a decrease in cash flow from changes in operating assets and liabilities of $24.9 million. The changes in operating assets and liabilities were largely attributable to a decrease in contract liabilities and increases in accounts receivables, and inventories, partially offset by a decrease in prepaid expenses and accrued expenses.
Previous wording
The cash provided by investing activities during the three months ended March 31, 2026 was primarily attributable to net cash provided for investment activity, partially offset by capital expenditures. The cash provided by investing activities
Current wording
The cash provided by investing activities during the six months ended June 30, 2026 was primarily attributable to net cash provided for investment activity, partially offset by capital expenditures. The cash provided by investing activities during the six months ended June 30, 2025 was primarily attributable to net cash provided for investment activity, partially offset by capital expenditures.
Previous wording
The cash used in financing activities for the three months ended March 31, 2026 was related to cash used to settle taxes related to employee equity programs, offset by cash received under the Employee Stock Purchase Plan. The cash used in financing activities for the three months ended March 31, 2025 was related to cash used to settle taxes related to employee equity programs, partially offset by cash received under the Employee Stock Purchase Plan.
Current wording
The cash used in financing activities for the six months ended June 30, 2026 was related to cash used to settle taxes related to employee equity programs, offset by cash received under the Employee Stock Purchase Plan. The cash used in financing activities for the six months ended June 30, 2025 was related to cash used to settle taxes related to employee
Previous wording
We have $230.0 million outstanding principal balance of convertible senior notes that bear interest at a rate of 2.875% per year, payable semiannually in arrears on June 1 and December 1 of each year, and mature on June 1, 2029, unless earlier purchased by the Company, redeemed, or converted.
Current wording
We have $230.0 million outstanding principal balance of convertible senior notes that bear interest at a rate of 2.875% per year, payable semiannually in arrears on June 1 and December 1 of each year, and mature on June 1, 2029, unless earlier purchased by the Company, redeemed, or converted. The 2029 Notes are currently convertible by noteholders until September 30, 2026.
Rearranged current paragraphs (8)
Current report — wording carried from elsewhere
The following table presents revenue and expense line items reported in our Consolidated Statements of Operations for the indicated periods in 2026 and 2025 and the period-over-period dollar and percentage changes for those line items. Our results of operations are reported as one business segment, represented by our single operating segment.
Current report — wording carried from elsewhere
The following is an analysis of sales by market and by region:
Current report — wording carried from elsewhere
Sales increased for the six months ended June 30, 2026 against the comparable prior year period driven by an increase in sales in the Data Storage, Compound Semiconductor, and Scientific & Other markets, partially offset by a decrease in sales in the Semiconductor market. By geography, sales increased in the United States, Rest of APAC, and EMEA, regions, partially offset by decreased sales in the China region. Sales in the Rest of APAC region for the six months ended June 30, 2026 included sales in Taiwan, Japan, and Singapore of $109.0 million, $19.1 million, and $14.0 million, respectively. Sales in the Rest of APAC region for the six months ended June 30, 2025 included sales in Taiwan, Singapore, and Japan of $78.0 million, $29.4 million, and $28.7 million, respectively. In light of the global nature of our business, we are impacted by conditions in the various countries in which we and our customers operate, including the recent tariff and trade dynamics. We expect there will continue to be year-to-year variations in our future sales distribution across markets and geographies.
Current report — wording carried from elsewhere
For the six months ended June 30, 2026, gross profit decreased against the comparable prior period due to a decrease in gross margins, partially offset by an increase in sales volume. Gross margins decreased principally due to unfavorable product mix and higher spending, including logistics costs. Additionally other factors will cause our gross margins to fluctuate each period, including the impact of the evolving tariffs landscape, which includes refunds on previously paid tariffs, newly implemented tariffs, or changes to existing tariffs.
Current report — wording carried from elsewhere
The markets we serve are characterized by continuous technological development and product innovation, and we invest in various research and development initiatives to maintain our competitive advantage and achieve our growth objectives. Research and development expenses increased for the six months ended June 30, 2026 against the comparable prior period due to an increase in personnel-related expenses.
Current report — wording carried from elsewhere
During the six months ended June 30, 2026, we incurred an additional $3.5 million in legal, accounting, consulting fees and employee-related costs in connection with the proposed Merger.
Current report — wording carried from elsewhere
We recorded net interest income of $2.3 million for the six months ended June 30, 2026, compared to net interest income of $1.7 million for the comparable prior year period. The increase in net interest income was primarily due to reduced interest expense on the 2025 Notes as they matured on January 15, 2025 and the 2027 Notes that were settled on May 15, 2025.
Current report — wording carried from elsewhere
Our tax expense for the six months ended June 30, 2026 was immaterial, compared to $3.9 million of tax expense for the comparable prior period. For the six months ended June 30, 2026, the effective tax rate was favorably impacted by the tax benefits related to Foreign-Derived Deduction Eligible Income and research and development tax credits. Additionally, the effective tax rate was also impacted by a discrete income tax benefit resulting from share-based compensation windfall. For the six months ended June 30, 2025, the effective tax rate was favorably impacted by tax benefits related to Foreign-Derived Intangible Income and research and development tax credits, partially offset by a discrete income tax expense resulting from the share-based compensation shortfall.
Rearranged previous paragraphs (2)
Previous report — wording carried elsewhere
Sales decreased for the three months ended March 31, 2026 against the comparable prior year period driven by a decrease in sales in the Semiconductor, and Scientific & Other markets, partially offset by an increase in sales in the
Previous report — wording carried elsewhere
during the three months ended March 31, 2025 was primarily attributable to net cash used for investment activity, partially offset by capital expenditures.