PHOTRONICS INC
For the period ended Oct 31, 2025. Filed Dec 17, 2025.
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FY2025 · Filed Dec 17, 2025
PLAB$28.92+5.7%Stored close · as of Nov 9, 2026
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Glossary of Terms and Acronyms
Definitions of certain terms and acronyms that may appear in this report are provided below.
| AI | Artificial intelligence |
|---|---|
| AMOLED | Active-matrix organic light-emitting diode. A technology used in mobile devices. |
| Application-specific IC | An integrated circuit customized for a particular use, rather than intended for general-purpose use |
| ASC | Accounting Standards Codification |
| ASP | Average Selling Price |
| ASU | Accounting Standards Update |
| CHIPS Act | U.S. CHIPS and Science Act of 2022 |
| CNY | Chinese Yuan |
| DNP | Dai Nippon Printing Co., Ltd. |
| EUV | A wafer lithography technology using the industry standard extreme ultraviolet (EUV) wavelength. EUV photomasks function by selectively reflecting or blocking light, in contrast to conventional photomasks which function by selectively transmitting or blocking light |
| Exchange Act | The Securities Exchange Act of 1934 (as amended) |
| FASB | Financial Accounting Standards Board |
| Form 10-Q | Quarterly Report on Form 10-Q |
| FPDs | Flat-panel displays, or “displays” |
| Generation | In reference to flat panel displays, refers to the size range of the underlying substrate to which a photomask is applied. Higher generation (or “G”) numbers represent larger substrates |
| High-end (photomasks) | For IC, photomasks that are 28nm or smaller; for FPD, AMOLED, G10.5+, and LTPS photomasks |
| ICs | Integrated circuits, or semiconductors |
| LTPS | Low-Temperature Poly Silicon, a polycrystalline silicon synthesized at relatively low temperatures; polycrystalline silicon in thin-film transistors (TFTs) are used in liquid-crystal display (LCD) flat panels and to drive organic light-emitting diode (OLED) displays |
| Mainstream (photomasks) | For IC, photomasks that service IC nodes greater than 28nm; for FPD, G8 and smaller photomasks |
| Optical proximity correction | A photolithography enhancement technique applied to compensate for the limitations of light to maintain the edge placement integrity of an original design, imaged onto a silicon wafer, for further processing to an etched pattern. |
| PDMCX | Xiamen American Japan Photronics Mask Co., Ltd., a joint venture of Photronics and DNP |
| ROU (assets) | Right-of-use asset |
| SEC | Securities and Exchange Commission |
| Securities Act | The Securities Act of 1933 (as amended) |
| SOC-1 report | Service Organization Control 1 report |
| U.S. GAAP | Accounting principles generally accepted in the United States of America |
| VIE | Variable Interest Entity |
| Wafer | A wafer, or silicon wafer, is a thin slice of semiconductor material that, in the fabrication of microelectronics, serves as the substrate for microelectronic devices built in and upon the wafer |
All references to “2025”, “2024”, and “2023” are to our fiscal years ended on October 31 of those years, unless otherwise stated.
The text of this filing, as the company filed it with the SEC, without its images or exhibits. This is not investment advice.