PHOTRONICS INC
For the period ended May 4, 2025. Filed Jun 11, 2025.
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A company's report for each of its first three quarters. The financial statements are not audited. It shows how the business has moved since the last annual report, and what management says changed.
May 4, 2025 · Filed Jun 11, 2025
PLAB$28.92+5.7%Stored close · as of Nov 9, 2026
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Glossary of Terms and Acronyms
Definitions of certain terms and acronyms that may appear in this report are provided below.
| AMOLED | Active-matrix organic light-emitting diode. A technology used in mobile devices. |
|---|---|
| ASC | Accounting Standards Codification |
| ASP | Average Selling Price |
| ASU | Accounting Standards Update |
| CNY | Chinese Yuan |
| DNP | Dai Nippon Printing Co., Ltd. |
| Exchange Act | The Securities Exchange Act of 1934 (as amended) |
| Form 10-Q | Quarterly Report on Form 10-Q |
| FPD | Flat Panel Display |
| FY | Fiscal Year |
| Generation | In reference to flat panel displays, refers to the size range of the underlying substrate to which a photomask is applied. Higher generation (or “G”) numbers represent larger substrates |
| High-end (photomasks) | For IC, photomasks that service IC nodes at 28nm or smaller; for FPD, AMOLED, G10.5+, and LTPS photomasks |
| IC | Integrated circuit |
| LTPS | Low-Temperature Poly Silicon, a polycrystalline silicon synthesized at relatively low temperatures; polycrystalline silicon in thin-film transistors (TFTs) are used in liquid-crystal display (LCD) flat panels and to drive organic light-emitting diode (OLED) displays |
| Mainstream (photomasks) | For IC, photomasks that service IC nodes greater than 28nm; for FPD, G8 and smaller photomasks |
| PDMCX | Xiamen American Japan Photronics Mask Co., Ltd., a joint venture of Photronics and DNP |
| ROU (assets) | Right-of-use asset |
| SEC | Securities and Exchange Commission |
| U.S. GAAP | Accounting principles generally accepted in the United States of America |
| VIE | Variable Interest Entity |
| Wafer | A wafer, or silicon wafer, is a thin slice of semiconductor material that, in the fabrication of microelectronics, serves as the substrate for microelectronic devices built in and upon the wafer |
The text of this filing, as the company filed it with the SEC, without its images or exhibits. This is not investment advice.