PHOTRONICS INC
For the period ended Jan 28, 2024. Filed Mar 7, 2024.
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A company's report for each of its first three quarters. The financial statements are not audited. It shows how the business has moved since the last annual report, and what management says changed.
Jan 28, 2024 · Filed Mar 7, 2024
PLAB$28.92+5.7%Stored close · as of Nov 9, 2026
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Glossary of Terms and Acronyms
Definitions of certain terms and acronyms that may appear in this report are provided below.
| AMOLED | Active-matrix organic light-emitting diode. A technology used in mobile devices. |
| Application-specific IC | An integrated circuit customized for a particular use, rather than intended for general-purpose use |
| ASC | Accounting Standards Codification |
| ASP | Average Selling Price |
| ASU | Accounting Standards Update |
| DNP | Dai Nippon Printing Co., Ltd. |
| EUV | A wafer lithography technology using the industry standard extreme ultraviolet (EUV) wavelength. EUV photomasks function by selectively reflecting or blocking light, in contrast to conventional photomasks which function by selectively transmitting or blocking light |
| Exchange Act | The Securities Exchange Act of 1934 (as amended) |
| FASB | Financial Accounting Standards Board |
| Form 10-Q | Quarterly Report on Form 10-Q |
| FPDs | Flat-panel displays, or “displays” |
| Generation | In reference to flat-panel displays, refers to the size range of the underlying substrate to which a photomask is applied. Higher generation (or “G”) numbers represent larger substrates |
| High-end (photomasks) | For IC, photomasks that are 28nm or smaller; for FPD, AMOLED, G10.5+, and LTPS photomasks |
| ICs | Integrated circuits, or semiconductors |
| LIBOR | London Inter-Bank Offered Rate |
| LTPS | Low-Temperature Poly Silicon, a polycrystalline silicon synthesized at relatively low temperatures; polycrystalline silicon in thin-film transistors (TFTs) are used in liquid-crystal display (LCD) flat panels and to drive organic light-emitting diode (OLED) displays |
| MLA | Master Lease Agreement |
| Optical proximity correction | A photolithography enhancement technique applied to compensate for the limitations of light to maintain the edge placement integrity of an original design, imaged onto a silicon wafer, for further processing to an etched pattern. |
| PDMCX | Xiamen American Japan Photronics Mask Co., Ltd., a joint venture of Photronics and DNP |
| Phase-shift photomasks | Photomasks that take advantage of the interference generated by phase differences to improve image resolution in photolithography |
| Pure-play foundry | A company that does not produce a significant volume of IC products of its own design, but rather operates IC fabrication plants dedicated to producing ICs for other companies |
| RMB | Chinese renminbi |
| ROU (assets) | Right-of-use asset |
| SEC | Securities and Exchange Commission |
| Securities Act | The Securities Act of 1933 (as amended) |
| Sputtering | The bombardment of a material with energetic particles to cause microscopic particles of the material to eject from its surface. |
| U.S. GAAP | Accounting principles generally accepted in the United States of America |
| Wafer | A wafer, or silicon wafer, is a thin slice of semiconductor material that, in the fabrication of microelectronics, serves as the substrate for microelectronic devices built in and upon the wafer |
The text of this filing, as the company filed it with the SEC, without its images or exhibits. This is not investment advice.