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TTM TECHNOLOGIES INC

For the period ended Dec 30, 2024. Filed Feb 21, 2025.

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A company's yearly report to the SEC, with audited financial statements. It is the fullest account a company gives of its business, its finances and the risks it sees.

FY2024 · Filed Feb 21, 2025

TTMI$75.33+13.3%Stored close · as of Nov 9, 2026

Extracted filing text, with the paragraph anchors used by the comparison.

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Contents

Item 2. PROPERTIES

The following table describes our headquarters and our principal manufacturing facilities as of December 30, 2024:

U.S. LocationsOperating SegmentLeased Square FeetOwned Square FeetTotal Square Feet
Chippewa Falls, WIPCB—280,086280,086
Farmingdale, NYPCB—171,600171,600
Forest Grove, ORPCB—212,453212,453
Huntington, NYPCB82,440—82,440
Littleton, COPCB54,59063,210117,800
Logan, UTPCB12,000118,448130,448
North Jackson, OHPCB8,80085,00093,800
Salem, NHPCB43,700—43,700
San Diego, CAPCB43,336—43,336
San Jose, CAPCB42,434—42,434
Santa Ana, CA (1)Headquarters14,472—14,472
Santa Ana, CAPCB13,43982,55095,989
Stafford, CTPCB—126,924126,924
Stafford Springs, CTPCB—115,579115,579
Sterling, VA (2)PCB100,896—100,896
Syracuse, NY (3)PCB andRF&S Components37,639162,587200,226
Total453,7461,418,4371,872,183
Foreign LocationsOperating SegmentLeased Square FeetOwned Square FeetTotal Square Feet
Canada
TorontoPCB15,50099,960115,460
Malaysia
PenangPCB827,000—827,000
China
DongguanPCB—1,069,1291,069,129
GuangzhouPCB—1,872,8001,872,800
Hong Kong (1)Asia Headquarters—24,64024,640
HuiyangPCB—435,485435,485
SuzhouRF&S Components68,030—68,030
ZhongshanPCB—1,132,7601,132,760
Total910,5304,634,7745,545,304

(1)

Location of our headquarters and not a manufacturing facility.

(2)

In December 2021, we entered into a joint venture agreement with our landlord, O.J.B./1600 University Boulevard, LLC, Count Du Greenmonet, LLC and GFI#2/DII, LLC, to jointly own approximately 100,896 square feet of land and building. We have a 50% ownership interest and we account for this joint venture under the equity method of accounting and do not consolidate our interest in the property.

(3)

Location includes two manufacturing facilities.

We maintain our properties in good operating condition. We believe that our properties are suitable and adequate for us to operate at present levels, and the productive capacity and extent of utilization of the facilities are appropriate for our existing manufacturing requirements.

On November 1, 2023, we announced our selection of Syracuse, New York as the location for a new proposed advanced technology PCB manufacturing facility. We expect that the proposed facility will bring advanced technology capability for our domestic high-volume production of ultra-high-density interconnect (HDI) PCBs in support of national security requirements. We believe the planned investment aligns with New York State’s continuing focus on the region as a premier technology hub for U.S. electronics and the recent selection of Buffalo-Rochester-Syracuse (BRS) for the Federal Tech Hub designation. The project reflects our support for cultivating a stronger microelectronics ecosystem in New York and across the U.S. Aerospace and Defense industrial base. We are continuing construction for the new building on the 24-acre property adjacent to our existing facility in Syracuse for the campus expansion and the site for the new facility, and we expect to commence initial low rate production in 2026. Phase one of the proposed project, including capital for campus-wide improvements is estimated to be $100.0 million to $130.0 million. We expect to receive support in the form of grants, awards, and tax credits from both federal and New York state sources of approximately

$52.0 million in the aggregate (subject to certain requirements and contingencies), which would offset the initial capital investment and lower operating expenses.

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