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TTM TECHNOLOGIES INC

For the period ended Jan 1, 2024. Filed Feb 27, 2024.

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A company's yearly report to the SEC, with audited financial statements. It is the fullest account a company gives of its business, its finances and the risks it sees.

FY2024 · Filed Feb 27, 2024

TTMI$75.33+13.3%Stored close · as of Nov 9, 2026

Extracted filing text, with the paragraph anchors used by the comparison.

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Contents

Item 2. PROPERTIES

The following table describes our headquarters and our principal manufacturing facilities.

U.S. LocationsOperatingSegmentLeasedSquare FeetOwnedSquare FeetTotalSquare Feet
Chippewa Falls, WIPCB—280,086280,086
Elizabeth City, NCPCB—47,78447,784
Farmingdale, NYPCB—171,600171,600
Forest Grove, ORPCB12,774212,453225,227
Huntington, NYPCB82,440—82,440
Littleton, COPCB54,59063,210117,800
Logan, UTPCB12,000118,448130,448
North Jackson, OHPCB8,80085,00093,800
Salem, NHPCB43,700—43,700
San Diego, CAPCB43,336—43,336
San Jose, CAPCB42,434—42,434
Santa Ana, CA (1)Headquarters14,472—14,472
Santa Ana, CAPCB9,41682,55091,966
Stafford, CTPCB—126,924126,924
Stafford Springs, CTPCB—115,579115,579
Sterling, VA (2)PCB100,896—100,896
Syracuse, NY (3)PCB andRF&S Components37,639162,587200,226
Total462,4971,466,2211,928,718
Foreign LocationsOperatingSegmentLeasedSquare FeetOwnedSquare FeetTotalSquare Feet
Canada
TorontoPCB15,50099,960115,460
Malaysia
PenangPCB827,000—827,000
China
DongguanPCB—1,069,1291,069,129
GuangzhouPCB—1,872,8001,872,800
Hong Kong (1)Asia Headquarters—24,64024,640
HuiyangPCB—435,485435,485
SuzhouRF&S Components68,030—68,030
ZhongshanPCB—1,132,7601,132,760
Total910,5304,634,7745,545,304

(1)

Location of our headquarters and not a manufacturing facility

(2)

In December 2021, we entered into a joint venture agreement with our landlord, O.J.B./1600 University Boulevard, LLC, Count Du Greenmonet, LLC and GFI#2/DII, LLC, to jointly own approximately 100,896 square feet of land and building. We have a 50% ownership interest and we account for this joint venture under the equity method of accounting and do not consolidate our interest in the property.

(3)

Location includes two manufacturing facilities

We maintain our properties in good operating condition. We believe that our properties are suitable and adequate for us to operate at present levels, and the productive capacity and extent of utilization of the facilities are appropriate for our existing manufacturing requirements.

On November 1, 2023, we announced that we had selected New York State as the location for a new proposed advanced technology PCB manufacturing facility. We are in the advanced stages of project planning, having identified the 24-acre property adjacent to our existing facility in Syracuse for the campus expansion and the site for the new facility. We have completed initial building designs and site layout, and are now applying for the required permitting. Groundbreaking is anticipated in the first half of 2024, with the project's final scale, scope, and timeline subject to finalizing funding with various stakeholders. Phase one of the proposed project, including capital for campus-wide improvements is estimated to be $100.0 million to $130.0 million, and is anticipated to run through 2026.

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The text of this filing, as the company filed it with the SEC, without its images or exhibits. This is not investment advice.