STMicroelectronics N.V.

For the period ended Jul 27, 2026. Filed Aug 19, 2026.

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What a company based outside the US has published at home or sent to its shareholders. It is how many foreign companies share results and news between annual reports.

Jul 27, 2026 · Filed Aug 19, 2026

STM$41.72+4.4%Stored close · as of Nov 6, 2026

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6-K 1 stm_sarxmaster-semiannual2.htm 6-K

UNITED STATES SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 6-K

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

Report on Form 6-K dated August 19, 2026

Commission File Number: 1-13546

STMicroelectronics N.V.

(Name of Registrant)

WTC Schiphol Airport

Schiphol Boulevard 265

1118 BH Schiphol Airport

The Netherlands

(Address of Principal Executive Offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F:

Form 20-FS Form 40-F☐

Enclosure: A press release dated August 19, 2026 announcing that STMicroelectronics has posted its IFRS 2026

Semi Annual Accounts, and the STMicroelectronics N.V. Semi Annual IFRS Report 2026.

Contents

1	CORPORATE OVERVIEW	7
	1.1.	History and development of STMicroelectronics	7
	1.2.	Strategy and objectives	7
	1.3.	Organizational structure	8
	1.4.	Products and activities	8
	1.5.	Sales, marketing and distribution	9
	1.6.	Research & Development	9
	1.7.	Sustainability	10
2	REPORT OF THE MANAGING BOARD	11
	2.1.	Business overview	11
	2.2.	Segment information	11
	2.3.	Liquidity and financial position	12
	2.4.	Business and financial outlook	15
	2.5.	Other developments	16
	2.6.	Related party transactions	17
	2.7.	Financial Risk Management	17
	2.8.	Business risk information	19
	2.9.	Auditor’s involvement	20
3	INTERIM CONDENSED CONSOLIDATED FINANCIAL STATEMENTS (“SEMI ANNUAL FINANCIAL STATEMENTS”)	21
	3.1.	Consolidated income statement	21
	3.2.	Consolidated statement of comprehensive income	22
	3.3.	Consolidated statement of financial position	23
	3.4.	Consolidated statement of changes in equity	24
	3.5.	Consolidated statement of cash flows	26
	3.6.	Notes to the consolidated financial statements	27
		3.6.1.	Corporate information	27
		3.6.2.	Basis of preparation	27
		3.6.3.	Significant accounting policies	27
		3.6.4.	Critical accounting estimates and judgements	28
		3.6.5.	Revenues	29
		3.6.6.	Segment information	31
		3.6.7.	Property, plant and equipment and intangible assets	32
		3.6.8.	Business combination	33
		3.6.9.	Goodwill	34
		3.6.10.	Other financial assets and financial liabilities	35
		3.6.11.	Other non-current assets	48
		3.6.12.	Leases	49
		3.6.13.	Inventories	50
		3.6.14.	Other receivables and assets	51
		3.6.15.	Cash and cash equivalents	51
		3.6.16.	Equity	51
		3.6.17.	Other non-current liabilities	54
		3.6.18.	Other payables and accrued liabilities	55
		3.6.19.	Provisions	55
		3.6.20.	Expenses by nature	56
		3.6.21.	Other income / expenses	57

		3.6.22.	Finance income / costs	58
		3.6.23.	Income tax	59
		3.6.24.	Earnings per share	59
		3.6.25.	Related-party transactions	59
		3.6.26.	Contingencies, claims and legal proceedings	60
		3.6.27.	Subsequent events	61
4	MANAGING BOARD’S STATEMENTS	62
5	ABOUT STMICROELECTRONICS	63

CERTAIN TERMS

AGM	annual general meeting of shareholders
AI	artificial intelligence
AM&S	analog products, MEMS and sensors
APeC	Asia Pacific excluding China
APMS	analog, power & discrete, MEMS and sensors
ASIC	application-specific integrated circuit
ASSP	application-specific standard product
BGA	ball grid array
Bi-CMOS	bipolar CMOS process technology
CapEx	capital expenditure
CMOS	complementary metal-on silicon oxide semiconductors
CODM	chief operating decision maker
RF COT	radio frequency chip-on-tag
CDP SpA Loans	Cassa Depositi e Prestiti SpA Loans
CSRD	EU Directive as regards corporate sustainability reporting (EU Directive 2022/2462)
CSC	corporation service company
D&RF	digital ICs and RF products
DRAM	dynamic random-access memory
EIB Loans	European investment bank loans
EMEA	Europe, Middle-East and Africa
ESG	environmental, social and governance
ESRS	European sustainability reporting standards
EU	European Union
EU Taxonomy Regulation	Regulation (EU) 2020/852 of the European Parliament and of the Council of jUne 18, 2020 on the establishment of a framework to facilitate sustainable investment and amending Regulation (EU) 2019/2088
Euronext Paris	Bourse de Paris
FD-SOI	fully depleted silicon-on-insulator
FVOCI	fair value through other comprehensive income
FVPL	fair value through profit and loss
GaN	gallium-nitride
GHG	greenhouse gas
GPU	graphics processing unit
IC	integrated circuit
IFRS	international financial reporting standards
IP	intellectual property
ISDA	international swaps and derivatives association
IDM	integrated device manufacturer
MCU	microcontrollers
MDRF	microcontrollers, digital ICs and RF products
MEMS	micro-electro-mechanical systems
Moody's	Moody's Investors Service
MOSFET	metal-on silicon oxide semiconductor field effect transistor
ODMs	original design manufacturers
OEMs	original equipment manufacturers

Omnibus	the proposal postponing the application of some reporting requirements in the CSRD and the transposition deadline and application of the CSDDD - Omnibus I - COM(2025)80 adopted by the European Commission on February 26. 2025
OSATs	outsourced semiconductor assembly and test
P&D	power and discrete products
PPA	power purchase agreement
R&D	research and development
RF	radio frequency
RF-SOI	radio frequency silicon-on-insulator
SAM	serviceable available market
Sanan ST JV	SANAN, STMicroelectronics Co. Ltd
SEC	U.S. Securities and Exchange Commission
SG&A	selling, general and administrative expenses
SiC	silicon carbide
SiPho	silicon photonics
SM&A	segment marketing and application
TAM	total available market
VIPower	vertically integrated power

ContentsView on SEC.gov

The text of this filing, as the company filed it with the SEC, without its images or exhibits. This is not investment advice.